Detailed engineering of media supply for cleanroom facilities in the semiconductor industry

SPIE AUTOMATION carried out the detailed planning of the media supply for four systems in an existing cleanroom of a customer from the semiconductor industry. The project’s goal was to precisely analyze, expand, and optimally design the existing infrastructure for new machines. This resulted in a consistent, future-proof plan for media supply and disposal as a basis for continued system operation.

Challenge and Objective

An existing cleanroom needed to be adapted for the use of new machines. However, the existing media infrastructure was only partially documented and not fully designed for the new requirements. Several media connections had to be checked, adapted, or newly developed. Additional planning was particularly needed for process cooling water. The customer therefore required a structured and reliable planning basis that covered both current needs and considered future expansions.

Solution

SPIE AUTOMATION took over the technical planning and conducted a comprehensive inventory at the start of the project. Using a 3D laser scan, the cleanroom, adjacent areas, and the relevant technical infrastructure were fully recorded. The data obtained served as the basis for further planning.

Based on this, the following services were provided:

Process engineering design of the required media
Creation of P&IDs as well as instrument and bill of materials
3D piping and layout planning including supports and necessary structural adjustments
Preparation of tender documents and support for awarding contracts
Project management and coordination of involved trades

Digital planning allowed for necessary adjustments to be considered during the project and changes to be implemented transparently.

Benefits

The customer received a fully planned and ready-to-implement media supply for the cleanroom. Based on this, the new machines can be integrated and operated in the existing environment. The planning also considers possible future expansions, allowing additional systems to be connected with manageable effort.

These SPIE AUTOMATION Strengths Were Applied

High flexibility in planning and quick adaptation to changing requirements
Holistic implementation from process engineering, design, planning, and project management
Efficient project execution through on-site presence and short decision-making paths
Precise inventory and planning using 3D laser scans
Solution-oriented approach to unclear existing data and project changes
Strong regional network for selecting and coordinating suitable partners

About Our Client

Our client is an innovative technology company in a highly specialized area of semiconductor development. With a strong focus on research and development, the company works on future-oriented solutions for modern data processing and electronic systems. A central component of the company’s technological expertise is the surface treatment of silicon wafers to create high-precision and functional layers for complex semiconductor structures.

Industry
Semiconductor Industry

Together with all involved departments, we successfully implemented the project despite numerous challenges. It is particularly noteworthy that the semiconductor industry is a new sector for us, and this was our first project in this field. Everything from a single source – everyone supports each other to achieve the common goal.